Difference between revisions of "Hardware/EMMC NAND"
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(Add Hynix eMMC) |
(Add yet another Samsung eMMC) |
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Class: Class400 | Class: Class400 | ||
Organisation: x8 | Organisation: x8 | ||
+ | Voltage : 1.7 - 1.95V / 2.7 - 3.6V | ||
+ | |||
+ | === Samsung KLMBG4GEND-B031 (32GB Deluxe/Premium models alternate) === | ||
+ | Partnumber: KLMBG4GEND-B031 | ||
+ | Density: 32GB | ||
+ | Controller: ? | ||
+ | Package: 153-ball BGA | ||
+ | Package type: ? | ||
+ | Package size: 11.5mm x 13mm | ||
+ | MMC version: eMMC5.0 | ||
+ | Class: ? | ||
+ | Organisation: ? | ||
Voltage : 1.7 - 1.95V / 2.7 - 3.6V | Voltage : 1.7 - 1.95V / 2.7 - 3.6V | ||
Revision as of 21:22, 17 September 2023
Differentiation
Samsung KLM8G2FE3B-B001 (8GB / Basic models)
Partnumber: KLM8G2FE3B-B00x Density: 8GB Controller: VFX_U Package: 153-ball BGA Package type: 2 chip (DDP) Package size: 11.5mm x 13mm MMC version: eMMC4.41 Class: Class100 Organisation: x8 Voltage : 1.7 - 1.95V / 2.7 - 3.6V
Samsung KLMBG4GE4A-A001 (32GB Deluxe/Premium models)
Partnumber: KLMAG2GE4A-A00x Density: 32GB Controller: VHX Package: 169-ball BGA Package type: 2 chip (DDP) Package size: 12mm x 16mm MMC version: eMMC4.41 Class: Class400 Organisation: x8 Voltage : 1.7 - 1.95V / 2.7 - 3.6V
Samsung KLMBG4GEND-B031 (32GB Deluxe/Premium models alternate)
Partnumber: KLMBG4GEND-B031 Density: 32GB Controller: ? Package: 153-ball BGA Package type: ? Package size: 11.5mm x 13mm MMC version: eMMC5.0 Class: ? Organisation: ? Voltage : 1.7 - 1.95V / 2.7 - 3.6V
Toshiba THGBM4G8D4GBAIE (32GB Deluxe/Premium models alternate)
Partnumber: THGBM4G8D4GBAIE Density: 32GB Controller: ? Package: 169-ball BGA Package type: ? Package size: 12mm x 16mm MMC version: eMMC4.41 Class: - Organisation: ? Voltage : 1.7 - 1.95V / 2.7 - 3.6V
Hynix H26M64002BNR (32GB Deluxe/Premium models alternate)
Partnumber: H26M64002BNR Density: 32GB Controller: ? Package: 169-ball BGA Package type: ? Package size: 14mm x 18mm MMC version: eMMC4.41 Class: ? Organisation: ? Voltage : 1.8V / 2.7V to 3.6V
Non WiiU examples
- Xbox-one: SK Hynix H26M42003GMR 8GB eMMC NAND Flash
- Xbox 360 Arcade consoles: Samsung KLM4G1HE3F-B001 (4GB class50 BGA153)
- PS3 CECH-40xx 12GB consoles: Samsung KLMAG2GE4A-A001 (16GB class400 BGA169)
- PSVita: Toshiba THGBM3G5D1FBAIE 4GB eMMC NAND Flash
Pinout
BGA169 Pad # |
MMC-plus (1-,4-,8-bit) Pad # |
MMC (1bit) Pad # |
SD (1-,4-bit) Pad # |
miniSD (1-,4-bit) Pad # |
microSD (1-,4-bit) Pad # |
Name | Type | Description |
---|---|---|---|---|---|---|---|---|
A-G 1-14 | - | - | - | - | - | NP or NC | - | not present or not connected |
H3 | 07 | 07 | 07 | 07 | 07 | DATA0 | I/O | Data I/O : Bidirectional channel used for data transfer |
H4 | 08 | - | 08 | 08 | 08 | DATA1 | I/O | Data I/O : Bidirectional channel used for data transfer |
H5 | 09 | - | 09 | 09 | 01 | DATA2 | I/O | Data I/O : Bidirectional channel used for data transfer |
J2 | 01 | 01 (NC) | 01 | 01 | 02 | DATA3 | I/O | Data I/O : Bidirectional channel used for data transfer |
J3 | 10 | - | - | - | - | DATA4 | I/O | Data I/O : Bidirectional channel used for data transfer |
J4 | 11 | - | - | - | - | DATA5 | I/O | Data I/O : Bidirectional channel used for data transfer |
J5 | 12 | - | - | - | - | DATA6 | I/O | Data I/O : Bidirectional channel used for data transfer |
J6 | 13 | - | - | - | - | DATA7 | I/O | Data I/O : Bidirectional channel used for data transfer |
K2 | 04 | 04 | 04 | 04 | 04 | VDDi | Supply | Internal power node. Connect 0.1uF capacitor from VDDi to ground. |
K4 | 03 / 06 | 03 / 06 | 03 / 06 | 03 / 06 | 06 | VSSQ | Ground | Memory controller core and MMC IF ground connection |
K6 | 04 | 04 | 04 | 04 | 04 | VCCQ | Supply | Memory controller core and MMC IF I/O power supply |
M6 | 04 | 04 | 04 | 04 | 04 | VCC | Supply | Flash I/O and memory power supply |
M7 | 03 / 06 | 03 / 06 | 03 / 06 | 03 / 06 | 06 | VSS | Ground | Flash I/O and memory ground connection |
N5 | 04 | 04 | 04 | 04 | 04 | VCC | Supply | Flash I/O and memory power supply |
P5 | 03 / 06 | 03 / 06 | 03 / 06 | 03 / 06 | 06 | VSS | Ground | Flash I/O and memory ground connection |
R10 | 03 / 06 | 03 / 06 | 03 / 06 | 03 / 06 | 06 | VSS | Ground | Flash I/O and memory ground connection |
T10 | 04 | 04 | 04 | 04 | 04 | VCC | Supply | Flash I/O and memory power supply |
U5 | - | - | - | - | - | RESET | Input | Hardware Reset (not connected on PS3 and Wii-U) |
U8 | 03 / 06 | 03 / 06 | 03 / 06 | 03 / 06 | 06 | VSS | Ground | Flash I/O and memory ground connection |
U9 | 04 | 04 | 04 | 04 | 04 | VCC | Supply | Flash I/O and memory power supply |
W4 | 04 | 04 | 04 | 04 | 04 | VCCQ | Supply | Memory controller core and MMC IF I/O power supply |
W5 | 02 | 02 | 02 | 02 | 03 | CMD | I/O | Command: A bidirectional channel used for device initialisation and command transfers |
W6 | 05 | 05 | 05 | 05 | 05 | CLK | Input | Clock: Each cycle directs a 1-bit transfer on the command and DAT lines |
Y2 | 03 / 06 | 03 / 06 | 03 / 06 | 03 / 06 | 06 | VSSQ | Ground | Memory controller core and MMC IF ground connection |
Y4 | 04 | 04 | 04 | 04 | 04 | VCCQ | Supply | Memory controller core and MMC IF I/O power supply |
Y5 | 03 / 06 | 03 / 06 | 03 / 06 | 03 / 06 | 06 | VSSQ | Ground | Memory controller core and MMC IF ground connection |
AA3 | 04 | 04 | 04 | 04 | 04 | VCCQ | Supply | Memory controller core and MMC IF I/O power supply |
AA4 | 03 / 06 | 03 / 06 | 03 / 06 | 03 / 06 | 06 | VSSQ | Ground | Memory controller core and MMC IF ground connection |
AA5 | 04 | 04 | 04 | 04 | 04 | VCCQ | Supply | Memory controller core and MMC IF I/O power supply |
AA6 | 03 / 06 | 03 / 06 | 03 / 06 | 03 / 06 | 06 | VSSQ | Ground | Memory controller core and MMC IF ground connection |
AB-HG 1-14 | - | - | - | - | - | NP or NC | - | not present or not connected |
remark: the following Pad #letter's are not used: I, O, Q, S, X, Z, AI, AO, AQ, AS, AX, AZ
Note: for hooking up to SD card reader the following might be needed:
- 50K nominal (10K - 90K range) Ohm pullup between VCC and DAT3/CD for card detect (see also Application Notes 10911)