In memory of Ben “bushing” Byer, who passed away on Monday, February 8th, 2016.

Difference between revisions of "Hardware/EMMC NAND"

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(Add Toshiba 8GB eMMC)
(Add another 32GB Toshiba eMMC, and reformat the page a little)
 
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== Differentiation ==
+
= Differentiation =
−
=== Samsung KLM8G2FE3B-B001 (8GB / Basic models) ===
+
== 8GB / Basic models ==
 +
=== Samsung KLM8G2FE3B-B001 ===
 
  Partnumber: KLM8G2FE3B-B00x
 
  Partnumber: KLM8G2FE3B-B00x
 
  Density:    8GB
 
  Density:    8GB
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  Voltage : 1.7 - 1.95V / 2.7 - 3.6V
 
  Voltage : 1.7 - 1.95V / 2.7 - 3.6V
  
−
=== Toshiba THGBM4G6D2HBAIR (8GB / Basic models alternative) ===
+
=== Toshiba THGBM4G6D2HBAIR ===
 
  Partnumber: THGBM4G6D2HBAIR
 
  Partnumber: THGBM4G6D2HBAIR
 
  Density: 8GB
 
  Density: 8GB
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  Voltage : 1.7 - 1.95V / 2.7 - 3.6V
 
  Voltage : 1.7 - 1.95V / 2.7 - 3.6V
  
−
=== Samsung KLMBG4GE4A-A001 (32GB Deluxe/Premium models) ===
+
== 32GB Deluxe/Premium models ==
 +
=== Samsung KLMBG4GE4A-A001 ===
 
  Partnumber: KLMAG2GE4A-A00x
 
  Partnumber: KLMAG2GE4A-A00x
 
  Density:    32GB
 
  Density:    32GB
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  Voltage : 1.7 - 1.95V / 2.7 - 3.6V
 
  Voltage : 1.7 - 1.95V / 2.7 - 3.6V
  
−
=== Samsung KLMBG4GEND-B031 (32GB Deluxe/Premium models alternate) ===
+
=== Samsung KLMBG4GEND-B031 ===
 
  Partnumber: KLMBG4GEND-B031
 
  Partnumber: KLMBG4GEND-B031
 
  Density:    32GB
 
  Density:    32GB
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  Voltage : 1.7 - 1.95V / 2.7 - 3.6V
 
  Voltage : 1.7 - 1.95V / 2.7 - 3.6V
  
−
=== Toshiba THGBM4G8D4GBAIE (32GB Deluxe/Premium models alternate) ===
+
=== Toshiba THGBM4G8D4GBAIE ===
 
  Partnumber: THGBM4G8D4GBAIE
 
  Partnumber: THGBM4G8D4GBAIE
 
  Density: 32GB
 
  Density: 32GB
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  Voltage : 1.7 - 1.95V / 2.7 - 3.6V
 
  Voltage : 1.7 - 1.95V / 2.7 - 3.6V
  
−
=== Hynix H26M64002BNR (32GB Deluxe/Premium models alternate) ===
+
=== Toshiba THGBM9G8T4KBAIR ===
 +
Partnumber: THGBM9G8T4KBAIR
 +
Density: 32GB
 +
Controller: ?
 +
Package: 153-ball BGA
 +
Package type: ?
 +
Package size: 12mmx13mm
 +
MMC version: eMMC5.0?
 +
Class: ?
 +
Organisation: ?
 +
Voltage: 1.7 - 1.95V / 2.7 - 3.6V
 +
 +
 
 +
=== Hynix H26M64002BNR ===
 
  Partnumber: H26M64002BNR
 
  Partnumber: H26M64002BNR
 
  Density: 32GB
 
  Density: 32GB
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* PSVita: Toshiba [http://download.siliconexpert.com/pdfs/2010/12/11/22/49/47/571/tos_/manual/thgbm3g5d1fbaie32nm4gbe-mmc_e_rev0.3_100917.pdf THGBM3G5D1FBAIE] 4GB eMMC NAND Flash
 
* PSVita: Toshiba [http://download.siliconexpert.com/pdfs/2010/12/11/22/49/47/571/tos_/manual/thgbm3g5d1fbaie32nm4gbe-mmc_e_rev0.3_100917.pdf THGBM3G5D1FBAIE] 4GB eMMC NAND Flash
  
−
== Pinout ==
+
= Pinout =
 
<div style="float:right">[[File:EMMC-BGA169.png|200px|thumb|left|eMMC-BGA169]]<br />[[File:MMCplus-13pads-layout.png|200px|thumb|left|MMC-plus 13pad layout]]<br />[[File:MMC-SD-miniSD-microSD-Color-Numbers-Names.jpg|200px|thumb|left|MMC, SD, miniSD, microSD cards pinout]]<br />[[File:EMMC pinout WiiU.jpg|200px|thumb|left|eMMC in Wii-U - pinout]]<br />[[File:EMMC removed WiiU.jpg|200px|thumb|left|eMMC in Wii-U removed (as you can see, only 4-bit mode is used)]]</div>
 
<div style="float:right">[[File:EMMC-BGA169.png|200px|thumb|left|eMMC-BGA169]]<br />[[File:MMCplus-13pads-layout.png|200px|thumb|left|MMC-plus 13pad layout]]<br />[[File:MMC-SD-miniSD-microSD-Color-Numbers-Names.jpg|200px|thumb|left|MMC, SD, miniSD, microSD cards pinout]]<br />[[File:EMMC pinout WiiU.jpg|200px|thumb|left|eMMC in Wii-U - pinout]]<br />[[File:EMMC removed WiiU.jpg|200px|thumb|left|eMMC in Wii-U removed (as you can see, only 4-bit mode is used)]]</div>
  

Latest revision as of 20:01, 24 February 2024

Differentiation

8GB / Basic models

Samsung KLM8G2FE3B-B001

Partnumber: KLM8G2FE3B-B00x
Density:    8GB
Controller: VFX_U
Package: 153-ball BGA
Package type: 2 chip (DDP)
Package size: 11.5mm x 13mm
MMC version: eMMC4.41
Class: Class100
Organisation: x8
Voltage : 1.7 - 1.95V / 2.7 - 3.6V

Toshiba THGBM4G6D2HBAIR

Partnumber: THGBM4G6D2HBAIR
Density: 8GB
Controller: ?
Package: 153-ball BGA
Package type: ?
Package size: 11.5mm x 13mm
MMC version: eMMC4.41
Class: ?
Organisation: ?
Voltage : 1.7 - 1.95V / 2.7 - 3.6V

32GB Deluxe/Premium models

Samsung KLMBG4GE4A-A001

Partnumber: KLMAG2GE4A-A00x
Density:    32GB
Controller: VHX
Package: 169-ball BGA
Package type: 2 chip (DDP)
Package size: 12mm x 16mm
MMC version: eMMC4.41
Class: Class400
Organisation: x8
Voltage : 1.7 - 1.95V / 2.7 - 3.6V

Samsung KLMBG4GEND-B031

Partnumber: KLMBG4GEND-B031
Density:    32GB
Controller: ?
Package: 153-ball BGA
Package type: ?
Package size: 11.5mm x 13mm
MMC version: eMMC5.0
Class: ?
Organisation: ?
Voltage : 1.7 - 1.95V / 2.7 - 3.6V

Toshiba THGBM4G8D4GBAIE

Partnumber: THGBM4G8D4GBAIE
Density: 32GB
Controller: ?
Package: 169-ball BGA
Package type: ?
Package size: 12mm x 16mm
MMC version: eMMC4.41
Class: -
Organisation: ?
Voltage : 1.7 - 1.95V / 2.7 - 3.6V

Toshiba THGBM9G8T4KBAIR

Partnumber: THGBM9G8T4KBAIR
Density: 32GB
Controller: ?
Package: 153-ball BGA
Package type: ?
Package size: 12mmx13mm
MMC version: eMMC5.0?
Class: ?
Organisation: ?
Voltage: 1.7 - 1.95V / 2.7 - 3.6V

Hynix H26M64002BNR

Partnumber: H26M64002BNR
Density: 32GB
Controller: ?
Package: 169-ball BGA
Package type: ?
Package size: 14mm x 18mm
MMC version: eMMC4.41
Class: ?
Organisation: ?
Voltage : 1.8V / 2.7V to 3.6V

Non WiiU examples

  • Xbox-one: SK Hynix H26M42003GMR 8GB eMMC NAND Flash
  • Xbox 360 Arcade consoles: Samsung KLM4G1HE3F-B001 (4GB class50 BGA153)
  • PS3 CECH-40xx 12GB consoles: Samsung KLMAG2GE4A-A001 (16GB class400 BGA169)
  • PSVita: Toshiba THGBM3G5D1FBAIE 4GB eMMC NAND Flash

Pinout

eMMC-BGA169

MMC-plus 13pad layout

MMC, SD, miniSD, microSD cards pinout

eMMC in Wii-U - pinout

eMMC in Wii-U removed (as you can see, only 4-bit mode is used)
BGA169
Pad #		 MMC-plus
(1-,4-,8-bit)
Pad #		 MMC
(1bit)
Pad #		 SD
(1-,4-bit)
Pad #		 miniSD
(1-,4-bit)
Pad #		 microSD
(1-,4-bit)
Pad #		 Name Type Description
A-G 1-14 - - - - - NP or NC - not present or not connected
H3 07 07 07 07 07 DATA0 I/O Data I/O : Bidirectional channel used for data transfer
H4 08 - 08 08 08 DATA1 I/O Data I/O : Bidirectional channel used for data transfer
H5 09 - 09 09 01 DATA2 I/O Data I/O : Bidirectional channel used for data transfer
J2 01 01 (NC) 01 01 02 DATA3 I/O Data I/O : Bidirectional channel used for data transfer
J3 10 - - - - DATA4 I/O Data I/O : Bidirectional channel used for data transfer
J4 11 - - - - DATA5 I/O Data I/O : Bidirectional channel used for data transfer
J5 12 - - - - DATA6 I/O Data I/O : Bidirectional channel used for data transfer
J6 13 - - - - DATA7 I/O Data I/O : Bidirectional channel used for data transfer
K2 04 04 04 04 04 VDDi Supply Internal power node. Connect 0.1uF capacitor from VDDi to ground.
K4 03 / 06 03 / 06 03 / 06 03 / 06 06 VSSQ Ground Memory controller core and MMC IF ground connection
K6 04 04 04 04 04 VCCQ Supply Memory controller core and MMC IF I/O power supply
M6 04 04 04 04 04 VCC Supply Flash I/O and memory power supply
M7 03 / 06 03 / 06 03 / 06 03 / 06 06 VSS Ground Flash I/O and memory ground connection
N5 04 04 04 04 04 VCC Supply Flash I/O and memory power supply
P5 03 / 06 03 / 06 03 / 06 03 / 06 06 VSS Ground Flash I/O and memory ground connection
R10 03 / 06 03 / 06 03 / 06 03 / 06 06 VSS Ground Flash I/O and memory ground connection
T10 04 04 04 04 04 VCC Supply Flash I/O and memory power supply
U5 - - - - - RESET Input Hardware Reset (not connected on PS3 and Wii-U)
U8 03 / 06 03 / 06 03 / 06 03 / 06 06 VSS Ground Flash I/O and memory ground connection
U9 04 04 04 04 04 VCC Supply Flash I/O and memory power supply
W4 04 04 04 04 04 VCCQ Supply Memory controller core and MMC IF I/O power supply
W5 02 02 02 02 03 CMD I/O Command: A bidirectional channel used for device initialisation and command transfers
W6 05 05 05 05 05 CLK Input Clock: Each cycle directs a 1-bit transfer on the command and DAT lines
Y2 03 / 06 03 / 06 03 / 06 03 / 06 06 VSSQ Ground Memory controller core and MMC IF ground connection
Y4 04 04 04 04 04 VCCQ Supply Memory controller core and MMC IF I/O power supply
Y5 03 / 06 03 / 06 03 / 06 03 / 06 06 VSSQ Ground Memory controller core and MMC IF ground connection
AA3 04 04 04 04 04 VCCQ Supply Memory controller core and MMC IF I/O power supply
AA4 03 / 06 03 / 06 03 / 06 03 / 06 06 VSSQ Ground Memory controller core and MMC IF ground connection
AA5 04 04 04 04 04 VCCQ Supply Memory controller core and MMC IF I/O power supply
AA6 03 / 06 03 / 06 03 / 06 03 / 06 06 VSSQ Ground Memory controller core and MMC IF ground connection
AB-HG 1-14 - - - - - NP or NC - not present or not connected

remark: the following Pad #letter's are not used: I, O, Q, S, X, Z, AI, AO, AQ, AS, AX, AZ

Note: for hooking up to SD card reader the following might be needed:

  • 50K nominal (10K - 90K range) Ohm pullup between VCC and DAT3/CD for card detect (see also Application Notes 10911)
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