Difference between revisions of "Hardware/TSOP NAND"
m (TP163 is not 3.3v but GND. You can use TP138 for 3.3v.) |
m (Create a differentiation 'table') |
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| − | + | = Pinout = | |
[[File:tsop-pinout.jpg|200px|thumb|right|TSOP NAND in Wii-U - pinout]] | [[File:tsop-pinout.jpg|200px|thumb|right|TSOP NAND in Wii-U - pinout]] | ||
| − | The pinout is the same between NAND chips, with all pins exposed via | + | The pinout is the same between NAND chips, with all pins exposed via empty resistor pads R38-R50, R152-154, and R148. TP138 can be used to provide 3.3v for powering the chip. Unlike most NANDs, this one has two separate 512MB banks: The first being used for vWii, and the second used for Wii U. This distinction between banks is done via the R/B and CE pins as RB1 and CE1 and RB2 and CE2 for vWii and Wii U respectively. The NAND itself can be dumped through the use of a Teensy2.0++ and the NANDway.py program commonly used to dump and restore PS3 NANDs similarly. |
| + | |||
| + | = Differentiation = | ||
| + | All manufacturers are found on all systems, regardless of 8GB/32GB model or board revision, with the exception of Spansion. | ||
| + | |||
| + | '''SK Hynix''': H27U8G8G5DTR | ||
| + | |||
| + | Notes: Some of these have "SK Hynix" markings, others just "hynix". There is no known difference between them (most likely just different batches). boot1 has mentions of "HY27UF084G2B" but these weren't ever used. | ||
| + | |||
| + | '''Samsung''': K9K8G08U1D | ||
| + | |||
| + | Notes: boot1 mentions K9XXG08XXB. This label ends with a B, yet the actual chip used ends with D. There are also two placeholders in that label. | ||
| + | |||
| + | '''Spansion''': S34ML08G101TFI20 | ||
| + | |||
| + | Notes: Seems to have been introduced in the WUP-30 production line (~2013). boot1 mentions Spansion, but doesn't have any mention of this NAND chip. | ||
| + | |||
| + | '''Toshiba''': TC58NVG2S3ETA00 | ||
| + | |||
| + | Notes: | ||
| + | |||
| + | [[Category:Hardware]] | ||
Latest revision as of 12:00, 23 October 2024
Pinout
The pinout is the same between NAND chips, with all pins exposed via empty resistor pads R38-R50, R152-154, and R148. TP138 can be used to provide 3.3v for powering the chip. Unlike most NANDs, this one has two separate 512MB banks: The first being used for vWii, and the second used for Wii U. This distinction between banks is done via the R/B and CE pins as RB1 and CE1 and RB2 and CE2 for vWii and Wii U respectively. The NAND itself can be dumped through the use of a Teensy2.0++ and the NANDway.py program commonly used to dump and restore PS3 NANDs similarly.
Differentiation
All manufacturers are found on all systems, regardless of 8GB/32GB model or board revision, with the exception of Spansion.
SK Hynix: H27U8G8G5DTR
Notes: Some of these have "SK Hynix" markings, others just "hynix". There is no known difference between them (most likely just different batches). boot1 has mentions of "HY27UF084G2B" but these weren't ever used.
Samsung: K9K8G08U1D
Notes: boot1 mentions K9XXG08XXB. This label ends with a B, yet the actual chip used ends with D. There are also two placeholders in that label.
Spansion: S34ML08G101TFI20
Notes: Seems to have been introduced in the WUP-30 production line (~2013). boot1 mentions Spansion, but doesn't have any mention of this NAND chip.
Toshiba: TC58NVG2S3ETA00
Notes: