EMMC NAND

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Contents

Differentiation

Samsung KLM8G2FE3B-B001 (8GB / Basic models)

Partnumber: KLM8G2FE3B-B00x
Density:    8GB
Controller: VFX_U
Package: 153-ball BGA
Package type: 2 chip (DDP)
Package size: 11.5mm x 13mm
MMC version: eMMC4.41
Class: Class100
Organisation: x8
Voltage : 1.7 - 1.95V / 2.7 - 3.6V

Samsung KLMBG4GE4A-A001 (32GB Deluxe/Premium models)

Partnumber: KLMAG2GE4A-A00x
Density:    32GB
Controller: VHX
Package: 169-ball BGA
Package type: 2 chip (DDP)
Package size: 12mm x 16mm
MMC version: eMMC4.41
Class: Class400
Organisation: x8
Voltage : 1.7 - 1.95V / 2.7 - 3.6V

Toshiba THGBM4G8D4GBAIE (32GB Deluxe/Premium models alternate)

Partnumber: THGBM4G8D4GBAIE
Density: 32GB
Controller: ?
Package: 169-ball BGA
Package type: ?
Package size: 12mm x 16mm
MMC version: eMMC4.41
Class: -
Organisation: ?
Voltage : 1.7 - 1.95V / 2.7 - 3.6V

Non WiiU examples

  • Xbox-one: SK Hynix H26M42003GMR 8GB eMMC NAND Flash
  • Xbox 360 Arcade consoles: Samsung KLM4G1HE3F-B001 (4GB class50 BGA153)
  • PS3 CECH-40xx 12GB consoles: Samsung KLMAG2GE4A-A001 (16GB class400 BGA169)
  • PSVita: Toshiba THGBM3G5D1FBAIE 4GB eMMC NAND Flash

Pinout

eMMC-BGA169

MMC-plus 13pad layout

MMC, SD, miniSD, microSD cards pinout

eMMC in Wii-U - pinout

eMMC in Wii-U removed (as you can see, only 4-bit mode is used)
BGA169
Pad #
MMC-plus
(1-,4-,8-bit)
Pad #
MMC
(1bit)
Pad #
SD
(1-,4-bit)
Pad #
miniSD
(1-,4-bit)
Pad #
microSD
(1-,4-bit)
Pad #
Name Type Description
A-G 1-14 - - - - - NP or NC - not present or not connected
H3 07 07 07 07 07 DATA0 I/O Data I/O : Bidirectional channel used for data transfer
H4 08 - 08 08 08 DATA1 I/O Data I/O : Bidirectional channel used for data transfer
H5 09 - 09 09 01 DATA2 I/O Data I/O : Bidirectional channel used for data transfer
J2 01 01 (NC) 01 01 02 DATA3 I/O Data I/O : Bidirectional channel used for data transfer
J3 10 - - - - DATA4 I/O Data I/O : Bidirectional channel used for data transfer
J4 11 - - - - DATA5 I/O Data I/O : Bidirectional channel used for data transfer
J5 12 - - - - DATA6 I/O Data I/O : Bidirectional channel used for data transfer
J6 13 - - - - DATA7 I/O Data I/O : Bidirectional channel used for data transfer
K2 04 04 04 04 04 VDDi Supply Internal power node. Connect 0.1uF capacitor from VDDi to ground.
K4 03 / 06 03 / 06 03 / 06 03 / 06 06 VSSQ Ground Memory controller core and MMC IF ground connection
K6 04 04 04 04 04 VCCQ Supply Memory controller core and MMC IF I/O power supply
M6 04 04 04 04 04 VCC Supply Flash I/O and memory power supply
M7 03 / 06 03 / 06 03 / 06 03 / 06 06 VSS Ground Flash I/O and memory ground connection
N5 04 04 04 04 04 VCC Supply Flash I/O and memory power supply
P5 03 / 06 03 / 06 03 / 06 03 / 06 06 VSS Ground Flash I/O and memory ground connection
R10 03 / 06 03 / 06 03 / 06 03 / 06 06 VSS Ground Flash I/O and memory ground connection
T10 04 04 04 04 04 VCC Supply Flash I/O and memory power supply
U5 - - - - - RESET Input Hardware Reset (not connected on PS3 and Wii-U)
U8 03 / 06 03 / 06 03 / 06 03 / 06 06 VSS Ground Flash I/O and memory ground connection
U9 04 04 04 04 04 VCC Supply Flash I/O and memory power supply
W4 04 04 04 04 04 VCCQ Supply Memory controller core and MMC IF I/O power supply
W5 02 02 02 02 03 CMD I/O Command: A bidirectional channel used for device initialisation and command transfers
W6 05 05 05 05 05 CLK Input Clock: Each cycle directs a 1-bit transfer on the command and DAT lines
Y2 03 / 06 03 / 06 03 / 06 03 / 06 06 VSSQ Ground Memory controller core and MMC IF ground connection
Y4 04 04 04 04 04 VCCQ Supply Memory controller core and MMC IF I/O power supply
Y5 03 / 06 03 / 06 03 / 06 03 / 06 06 VSSQ Ground Memory controller core and MMC IF ground connection
AA3 04 04 04 04 04 VCCQ Supply Memory controller core and MMC IF I/O power supply
AA4 03 / 06 03 / 06 03 / 06 03 / 06 06 VSSQ Ground Memory controller core and MMC IF ground connection
AA5 04 04 04 04 04 VCCQ Supply Memory controller core and MMC IF I/O power supply
AA6 03 / 06 03 / 06 03 / 06 03 / 06 06 VSSQ Ground Memory controller core and MMC IF ground connection
AB-HG 1-14 - - - - - NP or NC - not present or not connected

remark: the following Pad #letter's are not used: I, O, Q, S, X, Z, AI, AO, AQ, AS, AX, AZ

Note: for hooking up to SD card reader the following might be needed:

  • 50K nominal (10K - 90K range) Ohm pullup between VCC and DAT3/CD for card detect (see also Application Notes 10911)

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