Hardware/EMMC NAND
< Hardware
Differentiation
8GB / Basic models
Samsung KLM8G2FE3B-B001
Partnumber: KLM8G2FE3B-B00x Density: 8GB Controller: VFX_U Package: 153-ball BGA Package type: 2 chip (DDP) Package size: 11.5mm x 13mm MMC version: eMMC4.41 Class: Class100 Organisation: x8 Voltage : 1.7 - 1.95V / 2.7 - 3.6V
Toshiba THGBM4G6D2HBAIR
Partnumber: THGBM4G6D2HBAIR Density: 8GB Controller: ? Package: 153-ball BGA Package type: ? Package size: 11.5mm x 13mm MMC version: eMMC4.41 Class: ? Organisation: ? Voltage : 1.7 - 1.95V / 2.7 - 3.6V
32GB Deluxe/Premium models
Samsung KLMBG4GE4A-A001
Partnumber: KLMAG2GE4A-A00x Density: 32GB Controller: VHX Package: 169-ball BGA Package type: 2 chip (DDP) Package size: 12mm x 16mm MMC version: eMMC4.41 Class: Class400 Organisation: x8 Voltage : 1.7 - 1.95V / 2.7 - 3.6V
Samsung KLMBG4GEND-B031
Partnumber: KLMBG4GEND-B031 Density: 32GB Controller: ? Package: 153-ball BGA Package type: ? Package size: 11.5mm x 13mm MMC version: eMMC5.0 Class: ? Organisation: ? Voltage : 1.7 - 1.95V / 2.7 - 3.6V
Toshiba THGBM4G8D4GBAIE
Partnumber: THGBM4G8D4GBAIE Density: 32GB Controller: ? Package: 169-ball BGA Package type: ? Package size: 12mm x 16mm MMC version: eMMC4.41 Class: - Organisation: ? Voltage : 1.7 - 1.95V / 2.7 - 3.6V
Toshiba THGBM9G8T4KBAIR
Partnumber: THGBM9G8T4KBAIR Density: 32GB Controller: ? Package: 153-ball BGA Package type: ? Package size: 12mmx13mm MMC version: eMMC5.0? Class: ? Organisation: ? Voltage: 1.7 - 1.95V / 2.7 - 3.6V
Hynix H26M64002BNR
Partnumber: H26M64002BNR Density: 32GB Controller: ? Package: 169-ball BGA Package type: ? Package size: 14mm x 18mm MMC version: eMMC4.41 Class: ? Organisation: ? Voltage : 1.8V / 2.7V to 3.6V
Non WiiU examples
- Xbox-one: SK Hynix H26M42003GMR 8GB eMMC NAND Flash
- Xbox 360 Arcade consoles: Samsung KLM4G1HE3F-B001 (4GB class50 BGA153)
- PS3 CECH-40xx 12GB consoles: Samsung KLMAG2GE4A-A001 (16GB class400 BGA169)
- PSVita: Toshiba THGBM3G5D1FBAIE 4GB eMMC NAND Flash
Pinout
| BGA169 Pad # |
MMC-plus (1-,4-,8-bit) Pad # |
MMC (1bit) Pad # |
SD (1-,4-bit) Pad # |
miniSD (1-,4-bit) Pad # |
microSD (1-,4-bit) Pad # |
Name | Type | Description |
|---|---|---|---|---|---|---|---|---|
| A-G 1-14 | - | - | - | - | - | NP or NC | - | not present or not connected |
| H3 | 07 | 07 | 07 | 07 | 07 | DATA0 | I/O | Data I/O : Bidirectional channel used for data transfer |
| H4 | 08 | - | 08 | 08 | 08 | DATA1 | I/O | Data I/O : Bidirectional channel used for data transfer |
| H5 | 09 | - | 09 | 09 | 01 | DATA2 | I/O | Data I/O : Bidirectional channel used for data transfer |
| J2 | 01 | 01 (NC) | 01 | 01 | 02 | DATA3 | I/O | Data I/O : Bidirectional channel used for data transfer |
| J3 | 10 | - | - | - | - | DATA4 | I/O | Data I/O : Bidirectional channel used for data transfer |
| J4 | 11 | - | - | - | - | DATA5 | I/O | Data I/O : Bidirectional channel used for data transfer |
| J5 | 12 | - | - | - | - | DATA6 | I/O | Data I/O : Bidirectional channel used for data transfer |
| J6 | 13 | - | - | - | - | DATA7 | I/O | Data I/O : Bidirectional channel used for data transfer |
| K2 | 04 | 04 | 04 | 04 | 04 | VDDi | Supply | Internal power node. Connect 0.1uF capacitor from VDDi to ground. |
| K4 | 03 / 06 | 03 / 06 | 03 / 06 | 03 / 06 | 06 | VSSQ | Ground | Memory controller core and MMC IF ground connection |
| K6 | 04 | 04 | 04 | 04 | 04 | VCCQ | Supply | Memory controller core and MMC IF I/O power supply |
| M6 | 04 | 04 | 04 | 04 | 04 | VCC | Supply | Flash I/O and memory power supply |
| M7 | 03 / 06 | 03 / 06 | 03 / 06 | 03 / 06 | 06 | VSS | Ground | Flash I/O and memory ground connection |
| N5 | 04 | 04 | 04 | 04 | 04 | VCC | Supply | Flash I/O and memory power supply |
| P5 | 03 / 06 | 03 / 06 | 03 / 06 | 03 / 06 | 06 | VSS | Ground | Flash I/O and memory ground connection |
| R10 | 03 / 06 | 03 / 06 | 03 / 06 | 03 / 06 | 06 | VSS | Ground | Flash I/O and memory ground connection |
| T10 | 04 | 04 | 04 | 04 | 04 | VCC | Supply | Flash I/O and memory power supply |
| U5 | - | - | - | - | - | RESET | Input | Hardware Reset (not connected on PS3 and Wii-U) |
| U8 | 03 / 06 | 03 / 06 | 03 / 06 | 03 / 06 | 06 | VSS | Ground | Flash I/O and memory ground connection |
| U9 | 04 | 04 | 04 | 04 | 04 | VCC | Supply | Flash I/O and memory power supply |
| W4 | 04 | 04 | 04 | 04 | 04 | VCCQ | Supply | Memory controller core and MMC IF I/O power supply |
| W5 | 02 | 02 | 02 | 02 | 03 | CMD | I/O | Command: A bidirectional channel used for device initialisation and command transfers |
| W6 | 05 | 05 | 05 | 05 | 05 | CLK | Input | Clock: Each cycle directs a 1-bit transfer on the command and DAT lines |
| Y2 | 03 / 06 | 03 / 06 | 03 / 06 | 03 / 06 | 06 | VSSQ | Ground | Memory controller core and MMC IF ground connection |
| Y4 | 04 | 04 | 04 | 04 | 04 | VCCQ | Supply | Memory controller core and MMC IF I/O power supply |
| Y5 | 03 / 06 | 03 / 06 | 03 / 06 | 03 / 06 | 06 | VSSQ | Ground | Memory controller core and MMC IF ground connection |
| AA3 | 04 | 04 | 04 | 04 | 04 | VCCQ | Supply | Memory controller core and MMC IF I/O power supply |
| AA4 | 03 / 06 | 03 / 06 | 03 / 06 | 03 / 06 | 06 | VSSQ | Ground | Memory controller core and MMC IF ground connection |
| AA5 | 04 | 04 | 04 | 04 | 04 | VCCQ | Supply | Memory controller core and MMC IF I/O power supply |
| AA6 | 03 / 06 | 03 / 06 | 03 / 06 | 03 / 06 | 06 | VSSQ | Ground | Memory controller core and MMC IF ground connection |
| AB-HG 1-14 | - | - | - | - | - | NP or NC | - | not present or not connected |
remark: the following Pad #letter's are not used: I, O, Q, S, X, Z, AI, AO, AQ, AS, AX, AZ
Note: for hooking up to SD card reader the following might be needed:
- 50K nominal (10K - 90K range) Ohm pullup between VCC and DAT3/CD for card detect (see also Application Notes 10911)