Difference between revisions of "Motherboard"
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| Line 42: | Line 42: | ||
|U1 | |U1 | ||
|"(c)'12 NINTENDO" "AMD" "IBM" "RENESAS JAPAN" "C120234F5-852-UAA A" "1229LP7B7" | |"(c)'12 NINTENDO" "AMD" "IBM" "RENESAS JAPAN" "C120234F5-852-UAA A" "1229LP7B7" | ||
| − | | | + | | |
|Contains two dies: the GPU and the [[Hardware/Starbuck|Starbuck]]/[[Hardware/Espresso|Espresso]]. WUP-50 contains the revised B1X SoC. | |Contains two dies: the GPU and the [[Hardware/Starbuck|Starbuck]]/[[Hardware/Espresso|Espresso]]. WUP-50 contains the revised B1X SoC. | ||
|- | |- | ||
|U2-U5 | |U2-U5 | ||
| − | |Micron | + | |Micron MT41K256M16HA-125:E or SK Hynix H5TQ4G63MFR-12C |
|[[Media:4Gb_1_35V_DDR3L.pdf|Datasheet]] | |[[Media:4Gb_1_35V_DDR3L.pdf|Datasheet]] | ||
|RAM (4 BGA chips) (some models use drop-in replacement Hynix RAM). | |RAM (4 BGA chips) (some models use drop-in replacement Hynix RAM). | ||
|- | |- | ||
|U6 | |U6 | ||
| − | |Macronix | + | |Macronix MX25L6406E |
|[[Media:MX25L6406E_DS_EN.pdf|Datasheet]] | |[[Media:MX25L6406E_DS_EN.pdf|Datasheet]] | ||
| | | | ||
| Line 71: | Line 71: | ||
|- | |- | ||
|U13 | |U13 | ||
| + | |Mitsumi MM13486 | ||
| | | | ||
| − | | | + | |Audio amplifier. |
| − | |||
|- | |- | ||
|U14 | |U14 | ||
| − | |Panasonic | + | |Panasonic MN864718 |
| | | | ||
|HDMI controller. | |HDMI controller. | ||
|- | |- | ||
| − | |U17 | + | |U17 |
| − | | | + | |Macronix MX23L0002 |
| | | | ||
| − | |RTC | + | |RTC. |
|- | |- | ||
|U18 | |U18 | ||
| − | |SAMSUNG | + | |SAMSUNG K9K8G08U1D-SCB00 or SK Hynix H27U8G8G5DTR-BC |
|[[Media:K9k8g08u1d.pdf|Datasheet]] | |[[Media:K9k8g08u1d.pdf|Datasheet]] | ||
|Wii U OS/vWii [[Hardware/TSOP_NAND|NAND Flash]] (dual 4Gb banks). Toshiba, Hynix, and Spansion NANDs were also used. | |Wii U OS/vWii [[Hardware/TSOP_NAND|NAND Flash]] (dual 4Gb banks). Toshiba, Hynix, and Spansion NANDs were also used. | ||
| + | |- | ||
| + | |U19 | ||
| + | |ABLIC S-6450 | ||
| + | | | ||
| + | |RTC (alternative to U17). | ||
|- | |- | ||
|U20 | |U20 | ||
| − | |SAMSUNG | + | |SAMSUNG KLMBG4GE4A-A001 or SK Hynix H26M64002BNR or Toshiba THGBM4G8D4GBAIE |
|[https://web.archive.org/web/20141014035726/http://www.samsung.com/global/business/semiconductor/file/media/Samsung_eMMC_Brochure-0.pdf General info] | |[https://web.archive.org/web/20141014035726/http://www.samsung.com/global/business/semiconductor/file/media/Samsung_eMMC_Brochure-0.pdf General info] | ||
|32GB [[Hardware/EMMC NAND|eMMC]] (in 8 32Gb banks). Toshiba and Hynix eMMCs were also used. | |32GB [[Hardware/EMMC NAND|eMMC]] (in 8 32Gb banks). Toshiba and Hynix eMMCs were also used. | ||
| Line 103: | Line 108: | ||
|Rohm BD8878FV-E2 | |Rohm BD8878FV-E2 | ||
| | | | ||
| − | | | + | |Audio amplifier (alternative to U13). |
|- | |- | ||
|U1020 | |U1020 | ||
Revision as of 21:07, 1 December 2024
The Wii U had 3 motherboard revisions after the launch WUP-01 board.
| WUP-01 | |
|---|---|
| Top view (SIDE-B) | 
|
| Bottom view (SIDE-A | 
|
| WUP-30 | |
|---|---|
| Top view (SIDE-B) | 
|
| Bottom view (SIDE-A | 
|
| WUP-40 | |
|---|---|
| Top view (SIDE-B) | 
|
| Bottom view (SIDE-A | 
|
| WUP-50 | |
|---|---|
| Top view (SIDE-B) | 
|
| Bottom view (SIDE-A | 
|
Chip listing
| Label | Chip Name | Datasheet | Notes |
|---|---|---|---|
| U1 | "(c)'12 NINTENDO" "AMD" "IBM" "RENESAS JAPAN" "C120234F5-852-UAA A" "1229LP7B7" | Contains two dies: the GPU and the Starbuck/Espresso. WUP-50 contains the revised B1X SoC. | |
| U2-U5 | Micron MT41K256M16HA-125:E or SK Hynix H5TQ4G63MFR-12C | Datasheet | RAM (4 BGA chips) (some models use drop-in replacement Hynix RAM). |
| U6 | Macronix MX25L6406E | Datasheet | |
| U7 | DRH-WUP 811309G31 | Overview | Connects the Gamepad to the SoC via 5GHz Wi-Fi and USB. |
| U8 | SMC "1537EE402" "301" | SMC. "1537EE402" is different depending on board revision. | |
| U9 | |||
| U13 | Mitsumi MM13486 | Audio amplifier. | |
| U14 | Panasonic MN864718 | HDMI controller. | |
| U17 | Macronix MX23L0002 | RTC. | |
| U18 | SAMSUNG K9K8G08U1D-SCB00 or SK Hynix H27U8G8G5DTR-BC | Datasheet | Wii U OS/vWii NAND Flash (dual 4Gb banks). Toshiba, Hynix, and Spansion NANDs were also used. |
| U19 | ABLIC S-6450 | RTC (alternative to U17). | |
| U20 | SAMSUNG KLMBG4GE4A-A001 or SK Hynix H26M64002BNR or Toshiba THGBM4G8D4GBAIE | General info | 32GB eMMC (in 8 32Gb banks). Toshiba and Hynix eMMCs were also used. |
| U23/U26-U29 | USB interface ESD protection IC. | ||
| U56 | Rohm BD8878FV-E2 | Audio amplifier (alternative to U13). | |
| U1020 | Sanyo/Onsemi LV5066V | Step-down switching regulator controller. | |
| U1024-U1026/U1033 | Sanyo/Onsemi LV5065VB/LV5064VB or Rohm BD9171FUT-GE2 | DC/DC converter controller. | |
| U1037 | |||
| U1039 | |||
| U1041 | ABLIC S-6451AC-TCT1U | Power management IC. | |
| U1042 | Texas Instruments TPS54225 | Step-down converter (WUP-30/WUP-40 only). | |
| U1043 | Texas Instruments TPS54325 | Step-down converter (WUP-30/WUP-40 only). | |
| U1044 | Rohm BD00IC0WEFJ-E2 | LDO regulator (WUP-50 only). | |
| Q1019/Q1024/Q1037 | Fairchild DC4AY | PFETs for 1v/1.15v switching regulators. |