Difference between revisions of "Motherboard"
Jump to navigation
Jump to search
| Line 101: | Line 101: | ||
|- | |- | ||
|U56 | |U56 | ||
| + | |Rohm BD8878FV-E2 | ||
| | | | ||
| − | | | + | |Line amplifier. |
| − | |||
|- | |- | ||
|U1020 | |U1020 | ||
| Line 131: | Line 131: | ||
|- | |- | ||
|U1042 | |U1042 | ||
| + | |Texas Instruments TPS54225 | ||
| | | | ||
| + | |Step-down converter (WUP-30/WUP-40 only). | ||
| + | |- | ||
| + | |U1043 | ||
| + | |Texas Instruments TPS54325 | ||
| | | | ||
| − | |WUP-30/WUP-40 only. | + | |Step-down converter (WUP-30/WUP-40 only). |
|- | |- | ||
|U1044 | |U1044 | ||
| + | |Rohm BD00IC0WEFJ-E2 | ||
| | | | ||
| − | | | + | |LDO regulator (WUP-50 only). |
| − | |||
|- | |- | ||
|Q1019/Q1024/Q1037 | |Q1019/Q1024/Q1037 | ||
Revision as of 23:37, 24 November 2024
The Wii U had 3 motherboard revisions after the launch WUP-01 board.
| ExpandWUP-01 |
|---|
| ExpandWUP-30 |
|---|
| ExpandWUP-40 |
|---|
| ExpandWUP-50 |
|---|
Chip listing
| Label | Chip Name | Datasheet | Notes |
|---|---|---|---|
| U1 | "(c)'12 NINTENDO" "AMD" "IBM" "RENESAS JAPAN" "C120234F5-852-UAA A" "1229LP7B7" | None availaible | Contains two dies: the GPU and the Starbuck/Espresso. WUP-50 contains the revised B1X SoC. |
| U2-U5 | Micron "2LE12" "D9PXV" | Datasheet | RAM (4 BGA chips) (some models use drop-in replacement Hynix RAM). |
| U6 | Macronix "MXIC MX" "25L6406E" "M21-12GF" "3K645400" "L122483" | Datasheet | |
| U7 | DRH-WUP 811309G31 | Overview | Connects the Gamepad to the SoC via 5GHz Wi-Fi and USB. |
| U8 | SMC "1537EE402" "301" | SMC. "1537EE402" is different depending on board revision. | |
| U9 | |||
| U13 | |||
| U14 | Panasonic "MN864718" | HDMI controller. | |
| U17/U19 | "L1305" "23L0002" "3N188" "200" / "S6450" "A024" "DE83" "0023" | RTC. U17 (top RTC) has labels similar to those found on the MX chip on the Wii. U19 (bottom RTC) has labels similar to U1041. Only one is populated. | |
| U18 | SAMSUNG "222" "K9K8G08U1D" "SCB0" | Datasheet | Wii U OS/vWii NAND Flash (dual 4Gb banks). Toshiba, Hynix, and Spansion NANDs were also used. |
| U20 | SAMSUNG "228" "KLMBG4GE4A-A001" "WCF652C1" | General info | 32GB eMMC (in 8 32Gb banks). Toshiba and Hynix eMMCs were also used. |
| U23/U26-U29 | USB interface ESD protection IC. | ||
| U56 | Rohm BD8878FV-E2 | Line amplifier. | |
| U1020 | Sanyo/Onsemi LV5066V | Step-down switching regulator controller. | |
| U1024-U1026/U1033 | Sanyo/Onsemi LV5065VB/LV5064VB or Rohm BD9171FUT-GE2 | DC/DC converter controller. | |
| U1037 | |||
| U1039 | |||
| U1041 | ABLIC S-6451AC-TCT1U | Power management IC. | |
| U1042 | Texas Instruments TPS54225 | Step-down converter (WUP-30/WUP-40 only). | |
| U1043 | Texas Instruments TPS54325 | Step-down converter (WUP-30/WUP-40 only). | |
| U1044 | Rohm BD00IC0WEFJ-E2 | LDO regulator (WUP-50 only). | |
| Q1019/Q1024/Q1037 | Fairchild DC4AY | PFETs for 1v/1.15v switching regulators. |