| Label
|
Chip Name
|
Datasheet
|
Notes
|
| U1
|
"(c)'12 NINTENDO" "AMD" "IBM" "RENESAS JAPAN" "C120234F5-852-UAA A" "1229LP7B7"
|
None availaible
|
Contains two dies: the GPU and the Starbuck/Espresso. WUP-50 contains the revised B1X SoC.
|
| U2-U5
|
Micron "2LE12" "D9PXV"
|
Datasheet
|
RAM (4 BGA chips) (some models use drop-in replacement Hynix RAM).
|
| U6
|
Macronix "MXIC MX" "25L6406E" "M21-12GF" "3K645400" "L122483"
|
Datasheet
|
|
| U7
|
DRH-WUP 811309G31
|
Overview
|
Connects the Gamepad to the SoC via 5GHz Wi-Fi and USB.
|
| U8
|
SMC "1537EE402" "301"
|
|
SMC. "1537EE402" is different depending on board revision.
|
| U9
|
|
|
|
| U13
|
|
|
|
| U14
|
Panasonic "MN864718"
|
|
HDMI controller.
|
| U17/U19
|
"L1305" "23L0002" "3N188" "200" / "S6450" "A024" "DE83" "0023"
|
|
RTC. U17 (top RTC) has labels similar to those found on the MX chip on the Wii. U19 (bottom RTC) has labels similar to U1041. Only one is populated.
|
| U18
|
SAMSUNG "222" "K9K8G08U1D" "SCB0"
|
Datasheet
|
Wii U OS/vWii NAND Flash (dual 4Gb banks). Toshiba, Hynix, and Spansion NANDs were also used.
|
| U20
|
SAMSUNG "228" "KLMBG4GE4A-A001" "WCF652C1"
|
General info
|
32GB eMMC (in 8 32Gb banks). Toshiba and Hynix eMMCs were also used.
|
| U23/U26-U29
|
|
|
USB interface ESD protection IC.
|
| U56
|
|
|
|
| U1020
|
Sanyo/Onsemi LV5066V
|
|
Step-down switching regulator controller.
|
| U1024-U1026/U1033
|
Sanyo/Onsemi LV5065VB/LV5064VB or Rohm BD9171FUT-GE2
|
|
DC/DC converter controller.
|
| U1037
|
|
|
|
| U1039
|
|
|
|
| U1041
|
ABLIC S-6451AC-TCT1U
|
|
Power management IC.
|
| U1042
|
|
|
WUP-30/WUP-40 only.
|
| U1044
|
|
|
WUP-50 only.
|
| Q1019/Q1024/Q1037
|
Fairchild DC4AY
|
|
PFETs for 1v/1.15v switching regulators.
|
