Motherboard

The Wii U had 3 motherboard revisions after the launch WUP-01 board.

ExpandWUP-01
Top view (SIDE-B)
Bottom view (SIDE-A

ExpandWUP-30
Top view (SIDE-B)
Bottom view (SIDE-A

ExpandWUP-40
Top view (SIDE-B)
Bottom view (SIDE-A

ExpandWUP-50
Top view (SIDE-B)
Bottom view (SIDE-A

Chip listing

Label	Chip Name	Datasheet	Notes
U1	"(c)'12 NINTENDO" "AMD" "IBM" "RENESAS JAPAN" "C120234F5-852-UAA A" "1229LP7B7"		Contains two dies: the GPU and the Starbuck/Espresso. WUP-50 contains the revised B1X SoC.
U2-U5	Micron MT41K256M16HA-125:E or SK Hynix H5TQ4G63MFR-12C	Datasheet	RAM (4 BGA chips) (some models use drop-in replacement Hynix RAM).
U6	Macronix MX25L6406E	Datasheet
U7	DRH-WUP 811309G31	Overview	Connects the Gamepad to the SoC via 5GHz Wi-Fi and USB.
U8	SMC "1537EE402" "301"		SMC. "1537EE402" is different depending on board revision.
U9
U13	Mitsumi MM13486		Audio amplifier.
U14	Panasonic MN864718		HDMI controller.
U17	Macronix MX23L0002		RTC.
U18	SAMSUNG K9K8G08U1D-SCB00 or SK Hynix H27U8G8G5DTR-BC	Datasheet	Wii U OS/vWii NAND Flash (dual 4Gb banks). Toshiba, Hynix, and Spansion NANDs were also used.
U19	ABLIC S-6450		RTC (alternative to U17).
U20	SAMSUNG KLMBG4GE4A-A001 or SK Hynix H26M64002BNR or Toshiba THGBM4G8D4GBAIE	General info	32GB eMMC (in 8 32Gb banks). Toshiba and Hynix eMMCs were also used.
U23/U26-U29			USB interface ESD protection IC.
U56	Rohm BD8878FV-E2		Audio amplifier (alternative to U13).
U1020	Sanyo/Onsemi LV5066V		Step-down switching regulator controller.
U1024-U1026/U1033	Sanyo/Onsemi LV5065VB/LV5064VB or Rohm BD9171FUT-GE2		DC/DC converter controller.
U1037
U1039
U1041	ABLIC S-6451AC-TCT1U		Power management IC.
U1042	Texas Instruments TPS54225		Step-down converter (WUP-30/WUP-40 only).
U1043	Texas Instruments TPS54325		Step-down converter (WUP-30/WUP-40 only).
U1044	Rohm BD00IC0WEFJ-E2		LDO regulator (WUP-50 only).
Q1019/Q1024/Q1037	Fairchild DC4AY		PFETs for 1v/1.15v switching regulators.