301
edits
Changes
→Chip listing
Line 42:
Line 42:
|
|U1
|U1
|"(c)'12 NINTENDO" "AMD" "IBM" "RENESAS JAPAN" "C120234F5-852-UAA A" "1229LP7B7"
|"(c)'12 NINTENDO" "AMD" "IBM" "RENESAS JAPAN" "C120234F5-852-UAA A" "1229LP7B7"
−|None availaible
+|
|Contains two dies: the GPU and the [[Hardware/Starbuck|Starbuck]]/[[Hardware/Espresso|Espresso]]. WUP-50 contains the revised B1X SoC.
|Contains two dies: the GPU and the [[Hardware/Starbuck|Starbuck]]/[[Hardware/Espresso|Espresso]]. WUP-50 contains the revised B1X SoC.
|-
|-
|U2-U5
|U2-U5
−|Micron "2LE12" "D9PXV"
+|Micron MT41K256M16HA-125:E or SK Hynix H5TQ4G63MFR-12C
|[[Media:4Gb_1_35V_DDR3L.pdf|Datasheet]]
|[[Media:4Gb_1_35V_DDR3L.pdf|Datasheet]]
|RAM (4 BGA chips) (some models use drop-in replacement Hynix RAM).
|RAM (4 BGA chips) (some models use drop-in replacement Hynix RAM).
|-
|-
|U6
|U6
−|Macronix "MXIC MX" "25L6406E" "M21-12GF" "3K645400" "L122483"
+|Macronix MX25L6406E
|[[Media:MX25L6406E_DS_EN.pdf|Datasheet]]
|[[Media:MX25L6406E_DS_EN.pdf|Datasheet]]
|
|
Line 71:
Line 71:
|-
|-
|U13
|U13
+|Mitsumi MM13486
|
|
−|
+|Audio amplifier.
−|-
|-
|U14
|U14
−|Panasonic "MN864718"
+|Panasonic MN864718
|
|
|HDMI controller.
|HDMI controller.
|-
|-
−|U17/U19
+|U17
−|"L1305" "23L0002" "3N188" "200" / "S6450" "A024" "DE83" "0023"
+|Macronix MX23L0002
|
|
−|RTC. U17 (top RTC) has labels similar to those found on the MX chip on the Wii. U19 (bottom RTC) has labels similar to U1041. Only one is populated.
+|RTC.
|-
|-
|U18
|U18
−|SAMSUNG "222" "K9K8G08U1D" "SCB0"
+|SAMSUNG K9K8G08U1D-SCB00 or SK Hynix H27U8G8G5DTR-BC
|[[Media:K9k8g08u1d.pdf|Datasheet]]
|[[Media:K9k8g08u1d.pdf|Datasheet]]
|Wii U OS/vWii [[Hardware/TSOP_NAND|NAND Flash]] (dual 4Gb banks). Toshiba, Hynix, and Spansion NANDs were also used.
|Wii U OS/vWii [[Hardware/TSOP_NAND|NAND Flash]] (dual 4Gb banks). Toshiba, Hynix, and Spansion NANDs were also used.
+|-
+|U19
+|ABLIC S-6450
+|
+|RTC (alternative to U17).
|-
|-
|U20
|U20
−|SAMSUNG "228" "KLMBG4GE4A-A001" "WCF652C1"
+|SAMSUNG KLMBG4GE4A-A001 or SK Hynix H26M64002BNR or Toshiba THGBM4G8D4GBAIE
|[https://web.archive.org/web/20141014035726/http://www.samsung.com/global/business/semiconductor/file/media/Samsung_eMMC_Brochure-0.pdf General info]
|[https://web.archive.org/web/20141014035726/http://www.samsung.com/global/business/semiconductor/file/media/Samsung_eMMC_Brochure-0.pdf General info]
|32GB [[Hardware/EMMC NAND|eMMC]] (in 8 32Gb banks). Toshiba and Hynix eMMCs were also used.
|32GB [[Hardware/EMMC NAND|eMMC]] (in 8 32Gb banks). Toshiba and Hynix eMMCs were also used.
Line 103:
Line 108:
|Rohm BD8878FV-E2
|Rohm BD8878FV-E2
|
|
−|Line amplifier.
+|Audio amplifier (alternative to U13).
|-
|-
|U1020
|U1020