In memory of Ben “bushing” Byer, who passed away on Monday, February 8th, 2016.

Difference between revisions of "Motherboard"

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(Panasonic chip)
 
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=== Wii U Mainboard PCB, Top view (SIDE-B) ===
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The Wii U had 3 motherboard revisions after the launch WUP-01 board.
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[[Image:WiiUBoardFull.jpg]]
 
  
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=== Chip listing: ===
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{| class="mw-collapsible mw-collapsed wikitable"
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* "(c)'12 NINTENDO" "AMD" "IBM" "RENESAS JAPAN" "C120234F5-852-UAA A" "1229LP7B7"
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! colspan="2" | WUP-01
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* Macron "2LE12" "D9PXV" [[Media:4Gb_1_35V_DDR3L.pdf|Datasheet]]
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|-
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* SAMSUNG "228" "KLMBG4GE4A-A001" "WCF652C1" [http://www.samsung.com/global/business/semiconductor/file/media/Samsung_eMMC_Brochure-0.pdf General info]
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| Top view (SIDE-B) || [[File:WUP-01_top.jpg|500px]]
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* Macronix "MXIC MX" "25L6406E" "M21-12GF" "3K645400" "L122483" [[Media:MX25L6406E_DS_EN.pdf|Datasheet]]
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|-
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* SAMSUNG "222" "K9K8G08U1D" "SCB0" [[Media:K9k8g08u1d.pdf|Datasheet]]
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| Bottom view (SIDE-A) || [[File:WUP-01_bottom.jpg|500px]]
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* Panasonic "MN864718" - looks like it does the HDMI output, although I couldn't find a datasheet for this particular model.
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|}
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{| class="mw-collapsible mw-collapsed wikitable"
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! colspan="2" | WUP-30
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|-
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| Top view (SIDE-B) || [[File:WUP-30_top.jpg|500px]]
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|-
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| Bottom view (SIDE-A) || [[File:WUP-30_bottom.jpg|500px]]
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|}
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{| class="mw-collapsible mw-collapsed wikitable"
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! colspan="2" | WUP-40
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|-
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| Top view (SIDE-B) || [[File:WUP-40_top.jpg|500px]]
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|-
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| Bottom view (SIDE-A) || [[File:WUP-40_bottom.jpg|500px]]
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|}
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{| class="mw-collapsible mw-collapsed wikitable"
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! colspan="2" | WUP-50
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|-
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| Top view (SIDE-B) || [[File:WUP-50_top.jpg|500px]]
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|-
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| Bottom view (SIDE-A) || [[File:WUP-50_bottom.jpg|500px]]
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|}
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= Chip listing =
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{| class="wikitable sortable"
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! Label
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! Chip Name
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! Datasheet
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! Notes
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|-
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|U1
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|"(c)'12 NINTENDO" "AMD" "IBM" "RENESAS" C10234F5-852-UAA-A (WUP-01/WUP-30/WUP-40) or C10283F5-222-NNL-A (WUP-50)
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|
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|Contains the [[Hardware/Latte|Latte]], [[Hardware/Espresso|Espresso]] and [[Hardware/SEEPROM|SEEPROM]]. WUP-50 contains the revised B1X SoC.
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|-
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|U2-U5
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|Micron MT41K256M16HA-125:E or SK Hynix H5TQ4G63MFR-12C
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|[[Media:4Gb_1_35V_DDR3L.pdf|Datasheet]]
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|RAM (4 BGA chips) (some models use drop-in replacement Hynix RAM).
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|-
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|U6
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|Macronix MX25L6406E
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|[[Media:MX25L6406E_DS_EN.pdf|Datasheet]]
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|DRH-WUP serial flash.
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|-
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|U7
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|DRH-WUP 811309G31 (WUP-01/WUP-30/WUP-40) or DRH-WUP-1 812310D11 (WUP-50)
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|[http://libdrc.org/docs/re/overview.html Overview]
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|Connects the Gamepad to the SoC via 5GHz Wi-Fi and USB.
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|-
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|U8
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|SMC
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|
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|[[Hardware/SMC|SMC]].
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|-
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|U9
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|
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|
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|
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|-
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|U13
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|Mitsumi MM13486
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|
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|Audio amplifier.
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|-
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|U14
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|Panasonic MN864718
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|
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|HDMI controller.
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|-
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|U17
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|Macronix MX23L0002
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|
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|[[Hardware/RTC|RTC]].
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|-
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|U18
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|SAMSUNG K9K8G08U1D-SCB00 or SK Hynix H27U8G8G5DTR-BC
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|[[Media:K9k8g08u1d.pdf|Datasheet]]
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|Wii U OS/vWii [[Hardware/TSOP_NAND|NAND Flash]] (dual 4Gb banks). Toshiba, Hynix, and Spansion NANDs were also used.
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|-
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|U19
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|ABLIC S-6450
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|
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|RTC (alternative to U17).
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|-
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|U20
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|SAMSUNG KLMBG4GE4A-A001 or SK Hynix H26M64002BNR or Toshiba THGBM4G8D4GBAIE
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|[https://web.archive.org/web/20141014035726/http://www.samsung.com/global/business/semiconductor/file/media/Samsung_eMMC_Brochure-0.pdf General info]
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|32GB [[Hardware/EMMC NAND|eMMC]] (in 8 32Gb banks). Toshiba and Hynix eMMCs were also used.
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|-
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|U23/U26-U29
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|
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|
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|USB interface ESD protection IC.
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|-
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|U56
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|Rohm BD8878FV-E2
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|
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|Audio amplifier (alternative to U13).
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|-
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|U1020
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|Sanyo/Onsemi LV5066V
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|
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|Step-down switching regulator controller.
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|-
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|U1024-U1026/U1033
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|Sanyo/Onsemi LV5065VB/LV5064VB or Rohm BD9171FUT-GE2
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|
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|DC/DC converter controller.
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|-
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|U1037
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|
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|
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|
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|-
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|U1039
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|
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|
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|
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|-
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|U1041
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|ABLIC S-6451AC-TCT1U
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|
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|Power management IC.
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|-
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|U1042
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|Texas Instruments TPS54225
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|
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|Step-down converter (WUP-30/WUP-40 only).
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|-
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|U1043
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|Texas Instruments TPS54325
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|
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|Step-down converter (WUP-30/WUP-40 only).
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|-
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|U1044
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|Rohm BD00IC0WEFJ-E2
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|
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|LDO regulator (WUP-50 only).
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|-
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|Q1019/Q1024/Q1037
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|Fairchild DC4AY
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|
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|PFETs for 1v/1.15v switching regulators.
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|}

Latest revision as of 23:17, 2 December 2024

The Wii U had 3 motherboard revisions after the launch WUP-01 board.

WUP-01
Top view (SIDE-B) WUP-01 top.jpg
Bottom view (SIDE-A) WUP-01 bottom.jpg
WUP-30
Top view (SIDE-B) WUP-30 top.jpg
Bottom view (SIDE-A) WUP-30 bottom.jpg
WUP-40
Top view (SIDE-B) WUP-40 top.jpg
Bottom view (SIDE-A) WUP-40 bottom.jpg
WUP-50
Top view (SIDE-B) WUP-50 top.jpg
Bottom view (SIDE-A) WUP-50 bottom.jpg

Chip listing

Label Chip Name Datasheet Notes
U1 "(c)'12 NINTENDO" "AMD" "IBM" "RENESAS" C10234F5-852-UAA-A (WUP-01/WUP-30/WUP-40) or C10283F5-222-NNL-A (WUP-50) Contains the Latte, Espresso and SEEPROM. WUP-50 contains the revised B1X SoC.
U2-U5 Micron MT41K256M16HA-125:E or SK Hynix H5TQ4G63MFR-12C Datasheet RAM (4 BGA chips) (some models use drop-in replacement Hynix RAM).
U6 Macronix MX25L6406E Datasheet DRH-WUP serial flash.
U7 DRH-WUP 811309G31 (WUP-01/WUP-30/WUP-40) or DRH-WUP-1 812310D11 (WUP-50) Overview Connects the Gamepad to the SoC via 5GHz Wi-Fi and USB.
U8 SMC SMC.
U9
U13 Mitsumi MM13486 Audio amplifier.
U14 Panasonic MN864718 HDMI controller.
U17 Macronix MX23L0002 RTC.
U18 SAMSUNG K9K8G08U1D-SCB00 or SK Hynix H27U8G8G5DTR-BC Datasheet Wii U OS/vWii NAND Flash (dual 4Gb banks). Toshiba, Hynix, and Spansion NANDs were also used.
U19 ABLIC S-6450 RTC (alternative to U17).
U20 SAMSUNG KLMBG4GE4A-A001 or SK Hynix H26M64002BNR or Toshiba THGBM4G8D4GBAIE General info 32GB eMMC (in 8 32Gb banks). Toshiba and Hynix eMMCs were also used.
U23/U26-U29 USB interface ESD protection IC.
U56 Rohm BD8878FV-E2 Audio amplifier (alternative to U13).
U1020 Sanyo/Onsemi LV5066V Step-down switching regulator controller.
U1024-U1026/U1033 Sanyo/Onsemi LV5065VB/LV5064VB or Rohm BD9171FUT-GE2 DC/DC converter controller.
U1037
U1039
U1041 ABLIC S-6451AC-TCT1U Power management IC.
U1042 Texas Instruments TPS54225 Step-down converter (WUP-30/WUP-40 only).
U1043 Texas Instruments TPS54325 Step-down converter (WUP-30/WUP-40 only).
U1044 Rohm BD00IC0WEFJ-E2 LDO regulator (WUP-50 only).
Q1019/Q1024/Q1037 Fairchild DC4AY PFETs for 1v/1.15v switching regulators.
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