In memory of Ben “bushing” Byer, who passed away on Monday, February 8th, 2016.

Difference between revisions of "Motherboard"

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Line 4: Line 4:
 
! colspan="2" | WUP-01
 
! colspan="2" | WUP-01
 
|-
 
|-
−
! Top view (SIDE-B) || [[File:WUP-01_top.jpg|500px]]
+
| Top view (SIDE-B) || [[File:WUP-01_top.jpg|500px]]
 
|-
 
|-
−
| Bottom view (SIDE-A || [[File:WUP-01_bottom.jpg|500px]]
+
| Bottom view (SIDE-A) || [[File:WUP-01_bottom.jpg|500px]]
 
|}
 
|}
  
Line 12: Line 12:
 
! colspan="2" | WUP-30
 
! colspan="2" | WUP-30
 
|-
 
|-
−
! Top view (SIDE-B) || [[File:WUP-30_top.jpg|500px]]
+
| Top view (SIDE-B) || [[File:WUP-30_top.jpg|500px]]
 
|-
 
|-
−
| Bottom view (SIDE-A || [[File:WUP-30_bottom.jpg|500px]]
+
| Bottom view (SIDE-A) || [[File:WUP-30_bottom.jpg|500px]]
 
|}
 
|}
  
Line 20: Line 20:
 
! colspan="2" | WUP-40
 
! colspan="2" | WUP-40
 
|-
 
|-
−
! Top view (SIDE-B) || [[File:WUP-40_top.jpg|500px]]
+
| Top view (SIDE-B) || [[File:WUP-40_top.jpg|500px]]
 
|-
 
|-
−
| Bottom view (SIDE-A || [[File:WUP-40_bottom.jpg|500px]]
+
| Bottom view (SIDE-A) || [[File:WUP-40_bottom.jpg|500px]]
 
|}
 
|}
  
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! colspan="2" | WUP-50
 
! colspan="2" | WUP-50
 
|-
 
|-
−
! Top view (SIDE-B) || [[File:WUP-50_top.jpg|500px]]
+
| Top view (SIDE-B) || [[File:WUP-50_top.jpg|500px]]
 
|-
 
|-
−
| Bottom view (SIDE-A || [[File:WUP-50_bottom.jpg|500px]]
+
| Bottom view (SIDE-A) || [[File:WUP-50_bottom.jpg|500px]]
 
|}
 
|}
  
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|-
 
|-
 
|U1
 
|U1
−
|"(c)'12 NINTENDO" "AMD" "IBM" "RENESAS JAPAN" "C120234F5-852-UAA A" "1229LP7B7"
+
|"(c)'12 NINTENDO" "AMD" "IBM" "RENESAS" C10234F5-852-UAA-A (WUP-01/WUP-30/WUP-40) or C10283F5-222-NNL-A (WUP-50)
−
|None availaible
+
|
−
|Contains two dies: the GPU and the [[Hardware/Starbuck|Starbuck]]/[[Hardware/Espresso|Espresso]]. WUP-50 contains the revised B1X SoC.
+
|Contains the [[Hardware/Latte|Latte]], [[Hardware/Espresso|Espresso]] and [[Hardware/SEEPROM|SEEPROM]]. WUP-50 contains the revised B1X SoC.
 
|-
 
|-
 
|U2-U5
 
|U2-U5
−
|Micron "2LE12" "D9PXV"
+
|Micron MT41K256M16HA-125:E or SK Hynix H5TQ4G63MFR-12C
 
|[[Media:4Gb_1_35V_DDR3L.pdf|Datasheet]]
 
|[[Media:4Gb_1_35V_DDR3L.pdf|Datasheet]]
 
|RAM (4 BGA chips) (some models use drop-in replacement Hynix RAM).
 
|RAM (4 BGA chips) (some models use drop-in replacement Hynix RAM).
 
|-
 
|-
 
|U6
 
|U6
−
|Macronix "MXIC MX" "25L6406E" "M21-12GF" "3K645400" "L122483"
+
|Macronix MX25L6406E
 
|[[Media:MX25L6406E_DS_EN.pdf|Datasheet]]
 
|[[Media:MX25L6406E_DS_EN.pdf|Datasheet]]
−
|
+
|DRH-WUP serial flash.
 
|-
 
|-
 
|U7
 
|U7
−
|DRH-WUP 811309G31
+
|DRH-WUP 811309G31 (WUP-01/WUP-30/WUP-40) or DRH-WUP-1 812310D11 (WUP-50)
 
|[http://libdrc.org/docs/re/overview.html Overview]
 
|[http://libdrc.org/docs/re/overview.html Overview]
 
|Connects the Gamepad to the SoC via 5GHz Wi-Fi and USB.
 
|Connects the Gamepad to the SoC via 5GHz Wi-Fi and USB.
 
|-
 
|-
 
|U8
 
|U8
−
|SMC "1537EE402" "301"
+
|SMC
 
|
 
|
−
|SMC. "1537EE402" is different depending on board revision.
+
|[[Hardware/SMC|SMC]].
 
|-
 
|-
 
|U9
 
|U9
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|-
 
|-
 
|U13
 
|U13
 +
|Mitsumi MM13486
 
|
 
|
−
|
+
|Audio amplifier.
−
|
 
 
|-
 
|-
 
|U14
 
|U14
−
|Panasonic "MN864718"
+
|Panasonic MN864718
 
|
 
|
 
|HDMI controller.
 
|HDMI controller.
 
|-
 
|-
−
|U17/U19
+
|U17
−
|"L1305" "23L0002" "3N188" "200" / "S6450" "A024" "DE83" "0023"
+
|Macronix MX23L0002
 
|
 
|
−
|RTC. U17 (top RTC) has labels similar to those found on the MX chip on the Wii. U19 (bottom RTC) has labels similar to U1041. Only one is populated.
+
|[[Hardware/RTC|RTC]].
 
|-
 
|-
 
|U18
 
|U18
−
|SAMSUNG "222" "K9K8G08U1D" "SCB0"
+
|SAMSUNG K9K8G08U1D-SCB00 or SK Hynix H27U8G8G5DTR-BC
 
|[[Media:K9k8g08u1d.pdf|Datasheet]]
 
|[[Media:K9k8g08u1d.pdf|Datasheet]]
 
|Wii U OS/vWii [[Hardware/TSOP_NAND|NAND Flash]] (dual 4Gb banks). Toshiba, Hynix, and Spansion NANDs were also used.
 
|Wii U OS/vWii [[Hardware/TSOP_NAND|NAND Flash]] (dual 4Gb banks). Toshiba, Hynix, and Spansion NANDs were also used.
 +
|-
 +
|U19
 +
|ABLIC S-6450
 +
|
 +
|RTC (alternative to U17).
 
|-
 
|-
 
|U20
 
|U20
−
|SAMSUNG "228" "KLMBG4GE4A-A001" "WCF652C1"
+
|SAMSUNG KLMBG4GE4A-A001 or SK Hynix H26M64002BNR or Toshiba THGBM4G8D4GBAIE
 
|[https://web.archive.org/web/20141014035726/http://www.samsung.com/global/business/semiconductor/file/media/Samsung_eMMC_Brochure-0.pdf General info]
 
|[https://web.archive.org/web/20141014035726/http://www.samsung.com/global/business/semiconductor/file/media/Samsung_eMMC_Brochure-0.pdf General info]
 
|32GB [[Hardware/EMMC NAND|eMMC]] (in 8 32Gb banks). Toshiba and Hynix eMMCs were also used.
 
|32GB [[Hardware/EMMC NAND|eMMC]] (in 8 32Gb banks). Toshiba and Hynix eMMCs were also used.
Line 101: Line 106:
 
|-
 
|-
 
|U56
 
|U56
 +
|Rohm BD8878FV-E2
 
|
 
|
−
|
+
|Audio amplifier (alternative to U13).
−
|
 
 
|-
 
|-
 
|U1020
 
|U1020
Line 131: Line 136:
 
|-
 
|-
 
|U1042
 
|U1042
 +
|Texas Instruments TPS54225
 
|
 
|
 +
|Step-down converter (WUP-30/WUP-40 only).
 +
|-
 +
|U1043
 +
|Texas Instruments TPS54325
 
|
 
|
−
|WUP-30/WUP-40 only.
+
|Step-down converter (WUP-30/WUP-40 only).
 
|-
 
|-
 
|U1044
 
|U1044
 +
|Rohm BD00IC0WEFJ-E2
 
|
 
|
−
|
+
|LDO regulator (WUP-50 only).
−
|WUP-50 only.
 
 
|-
 
|-
 
|Q1019/Q1024/Q1037
 
|Q1019/Q1024/Q1037

Latest revision as of 23:17, 2 December 2024

The Wii U had 3 motherboard revisions after the launch WUP-01 board.

WUP-01
Top view (SIDE-B) WUP-01 top.jpg
Bottom view (SIDE-A) WUP-01 bottom.jpg
WUP-30
Top view (SIDE-B) WUP-30 top.jpg
Bottom view (SIDE-A) WUP-30 bottom.jpg
WUP-40
Top view (SIDE-B) WUP-40 top.jpg
Bottom view (SIDE-A) WUP-40 bottom.jpg
WUP-50
Top view (SIDE-B) WUP-50 top.jpg
Bottom view (SIDE-A) WUP-50 bottom.jpg

Chip listing

Label Chip Name Datasheet Notes
U1 "(c)'12 NINTENDO" "AMD" "IBM" "RENESAS" C10234F5-852-UAA-A (WUP-01/WUP-30/WUP-40) or C10283F5-222-NNL-A (WUP-50) Contains the Latte, Espresso and SEEPROM. WUP-50 contains the revised B1X SoC.
U2-U5 Micron MT41K256M16HA-125:E or SK Hynix H5TQ4G63MFR-12C Datasheet RAM (4 BGA chips) (some models use drop-in replacement Hynix RAM).
U6 Macronix MX25L6406E Datasheet DRH-WUP serial flash.
U7 DRH-WUP 811309G31 (WUP-01/WUP-30/WUP-40) or DRH-WUP-1 812310D11 (WUP-50) Overview Connects the Gamepad to the SoC via 5GHz Wi-Fi and USB.
U8 SMC SMC.
U9
U13 Mitsumi MM13486 Audio amplifier.
U14 Panasonic MN864718 HDMI controller.
U17 Macronix MX23L0002 RTC.
U18 SAMSUNG K9K8G08U1D-SCB00 or SK Hynix H27U8G8G5DTR-BC Datasheet Wii U OS/vWii NAND Flash (dual 4Gb banks). Toshiba, Hynix, and Spansion NANDs were also used.
U19 ABLIC S-6450 RTC (alternative to U17).
U20 SAMSUNG KLMBG4GE4A-A001 or SK Hynix H26M64002BNR or Toshiba THGBM4G8D4GBAIE General info 32GB eMMC (in 8 32Gb banks). Toshiba and Hynix eMMCs were also used.
U23/U26-U29 USB interface ESD protection IC.
U56 Rohm BD8878FV-E2 Audio amplifier (alternative to U13).
U1020 Sanyo/Onsemi LV5066V Step-down switching regulator controller.
U1024-U1026/U1033 Sanyo/Onsemi LV5065VB/LV5064VB or Rohm BD9171FUT-GE2 DC/DC converter controller.
U1037
U1039
U1041 ABLIC S-6451AC-TCT1U Power management IC.
U1042 Texas Instruments TPS54225 Step-down converter (WUP-30/WUP-40 only).
U1043 Texas Instruments TPS54325 Step-down converter (WUP-30/WUP-40 only).
U1044 Rohm BD00IC0WEFJ-E2 LDO regulator (WUP-50 only).
Q1019/Q1024/Q1037 Fairchild DC4AY PFETs for 1v/1.15v switching regulators.
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