| Label
|
Chip Name
|
Datasheet
|
Notes
|
| U1
|
"(c)'12 NINTENDO" "AMD" "IBM" "RENESAS" C10234F5-852-UAA-A (WUP-01/WUP-30/WUP-40) or C10283F5-222-NNL-A (WUP-50)
|
|
Contains the Latte, Espresso and SEEPROM. WUP-50 contains the revised B1X SoC.
|
| U2-U5
|
Micron MT41K256M16HA-125:E or SK Hynix H5TQ4G63MFR-12C
|
Datasheet
|
RAM (4 BGA chips) (some models use drop-in replacement Hynix RAM).
|
| U6
|
Macronix MX25L6406E
|
Datasheet
|
DRH-WUP serial flash.
|
| U7
|
DRH-WUP 811309G31 (WUP-01/WUP-30/WUP-40) or DRH-WUP-1 812310D11 (WUP-50)
|
Overview
|
Connects the Gamepad to the SoC via 5GHz Wi-Fi and USB.
|
| U8
|
SMC
|
|
SMC.
|
| U9
|
|
|
|
| U13
|
Mitsumi MM13486
|
|
Audio amplifier.
|
| U14
|
Panasonic MN864718
|
|
HDMI controller.
|
| U17
|
Macronix MX23L0002
|
|
RTC.
|
| U18
|
SAMSUNG K9K8G08U1D-SCB00 or SK Hynix H27U8G8G5DTR-BC
|
Datasheet
|
Wii U OS/vWii NAND Flash (dual 4Gb banks). Toshiba, Hynix, and Spansion NANDs were also used.
|
| U19
|
ABLIC S-6450
|
|
RTC (alternative to U17).
|
| U20
|
SAMSUNG KLMBG4GE4A-A001 or SK Hynix H26M64002BNR or Toshiba THGBM4G8D4GBAIE
|
General info
|
32GB eMMC (in 8 32Gb banks). Toshiba and Hynix eMMCs were also used.
|
| U23/U26-U29
|
|
|
USB interface ESD protection IC.
|
| U56
|
Rohm BD8878FV-E2
|
|
Audio amplifier (alternative to U13).
|
| U1020
|
Sanyo/Onsemi LV5066V
|
|
Step-down switching regulator controller.
|
| U1024-U1026/U1033
|
Sanyo/Onsemi LV5065VB/LV5064VB or Rohm BD9171FUT-GE2
|
|
DC/DC converter controller.
|
| U1037
|
|
|
|
| U1039
|
|
|
|
| U1041
|
ABLIC S-6451AC-TCT1U
|
|
Power management IC.
|
| U1042
|
Texas Instruments TPS54225
|
|
Step-down converter (WUP-30/WUP-40 only).
|
| U1043
|
Texas Instruments TPS54325
|
|
Step-down converter (WUP-30/WUP-40 only).
|
| U1044
|
Rohm BD00IC0WEFJ-E2
|
|
LDO regulator (WUP-50 only).
|
| Q1019/Q1024/Q1037
|
Fairchild DC4AY
|
|
PFETs for 1v/1.15v switching regulators.
|
