Motherboard: Difference between revisions

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m Hexkyz moved page Wii U/console/motherboard to Motherboard: Condensing hardware pages
Lazr (talk | contribs)
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Completely revamp the page. WUP-30 scans will be added soontm
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=== Wii U Mainboard PCB, Top view (SIDE-B) ===
The Wii U had 3 motherboard revisions after the launch WUP-01 board.
[[Image:Mainboard_Front.jpg|800px]]


Another photo, without markings:
== WUP-01 ==
=== Top view (SIDE-B) ===
[[File:WUP-01_top.jpg|500px]]
=== Bottom view (SIDE-A) ===
[[File:WUP-01_bottom.jpg|500px]]


[[File:WUP-001 Motherboard.jpg|200px]]
== WUP-30 ==
=== Top view (SIDE-B) ===
TODO
=== Bottom view (SIDE-A) ===
TODO


=== Wii U Mainboard PCB, Bottom view (SIDE-A) ===
== WUP-40 ==
[[File:WiiU_motherboard_sideA.jpg|200px]]
=== Top view (SIDE-B) ===
[[File:WUP-40_top.jpg|500px]]
=== Bottom view (SIDE-A) ===
[[File:WUP-40_bottom.jpg|500px]]


=== Chip listing: ===
== WUP-50 ==
=== Top view (SIDE-B) ===
[[File:WUP-50_top.jpg|500px]]
=== Bottom view (SIDE-A) ===
[[File:WUP-50_bottom.jpg|500px]]
 
== Chip listing: ==
{| class="wikitable sortable"
{| class="wikitable sortable"
! Label
! Label
! Colour
! Chip Name
! Chip Name
! Datasheet
! Datasheet
Line 18: Line 33:
|-
|-
|U1
|U1
|
|"(c)'12 NINTENDO" "AMD" "IBM" "RENESAS JAPAN" "C120234F5-852-UAA A" "1229LP7B7"
|"(c)'12 NINTENDO" "AMD" "IBM" "RENESAS JAPAN" "C120234F5-852-UAA A" "1229LP7B7"
|None availaible
|None availaible
|Contains two dies: the GPU and the [[Hardware/Starbuck|Starbuck]]/[[Hardware/Espresso|Espresso]]
|Contains two dies: the GPU and the [[Hardware/Starbuck|Starbuck]]/[[Hardware/Espresso|Espresso]]. WUP-50 contains the revised B1X SoC.
|-
|-
|U2-5
|U2-5
|Yellow
|Micron "2LE12" "D9PXV"
|Micron "2LE12" "D9PXV"
|[[Media:4Gb_1_35V_DDR3L.pdf|Datasheet]]
|[[Media:4Gb_1_35V_DDR3L.pdf|Datasheet]]
|RAM (4 BGA chips) (Some models use drop-in replacement hynix RAM)
|RAM (4 BGA chips) (Some models use drop-in replacement hynix RAM)
|-
|-
|U20
|U6
|Orange
|SAMSUNG "228" "KLMBG4GE4A-A001" "WCF652C1"
|[https://web.archive.org/web/20141014035726/http://www.samsung.com/global/business/semiconductor/file/media/Samsung_eMMC_Brochure-0.pdf General info]
|32GB [[Hardware/EMMC NAND|eMMC]] (in 8 32Gb banks)
|-
|
|
|Macronix "MXIC MX" "25L6406E" "M21-12GF" "3K645400" "L122483"
|Macronix "MXIC MX" "25L6406E" "M21-12GF" "3K645400" "L122483"
|[[Media:MX25L6406E_DS_EN.pdf|Datasheet]]
|[[Media:MX25L6406E_DS_EN.pdf|Datasheet]]
|
|
|-
|-
|U7
|DRH-WUP 811309G31
|[http://libdrc.org/docs/re/overview.html Overview]
|Connects the Gamepad to the SoC via 5GHz Wi-Fi and USB
|-
|U8
|SMC "1537EE402" "301"
|
|
|Black
|SMC. "1537EE402" is different depending on board revision.
|SAMSUNG "222" "K9K8G08U1D" "SCB0"
|[[Media:K9k8g08u1d.pdf|Datasheet]]
|Wii U OS/vWii [[Hardware/TSOP_NAND|NAND Flash]] (dual 4Gb banks)
|-
|-
|U14
|U14
|Red
|Panasonic "MN864718"
|Panasonic "MN864718"
|
|
|HDMI Controller
|HDMI Controller
|-
|U17/U19
|"L1305" "23L0002" "3N188" "200" / "S6450" "A024" "DE83" "0023"
|
|RTC. U17 (top RTC) has labels similar to those found on the MX chip on the Wii. U19 (bottom RTC) has labels similar to U1041. Only one is populated.
|-
|U18
|SAMSUNG "222" "K9K8G08U1D" "SCB0"
|[[Media:K9k8g08u1d.pdf|Datasheet]]
|Wii U OS/vWii [[Hardware/TSOP_NAND|NAND Flash]] (dual 4Gb banks). Toshiba, Hynix, and Spansion NANDs were also used.
|-
|U20
|SAMSUNG "228" "KLMBG4GE4A-A001" "WCF652C1"
|[https://web.archive.org/web/20141014035726/http://www.samsung.com/global/business/semiconductor/file/media/Samsung_eMMC_Brochure-0.pdf General info]
|32GB [[Hardware/EMMC NAND|eMMC]] (in 8 32Gb banks). Toshiba and Hynix eMMCs were also used.
|-
|-
|Q1019,1024,1037
|Q1019,1024,1037
|Blue
|Fairchild DC4AY
|Fairchild DC4AY
|
|
|Inductors nearby, so probably some sort of PMIC/Switching Regulator
|PFETs for 1v/1.15v switching regulators.
|-
|U7
|Green
|DRH-WUP 811309G31
|[http://libdrc.org/docs/re/overview.html Overview]
|Connects the Gamepad to the SoC via 5GHz Wi-Fi and USB
|}
|}

Revision as of 04:14, 19 November 2024

The Wii U had 3 motherboard revisions after the launch WUP-01 board.

WUP-01

Top view (SIDE-B)

Bottom view (SIDE-A)

WUP-30

Top view (SIDE-B)

TODO

Bottom view (SIDE-A)

TODO

WUP-40

Top view (SIDE-B)

Bottom view (SIDE-A)

WUP-50

Top view (SIDE-B)

Bottom view (SIDE-A)

Chip listing:

Label Chip Name Datasheet Notes
U1 "(c)'12 NINTENDO" "AMD" "IBM" "RENESAS JAPAN" "C120234F5-852-UAA A" "1229LP7B7" None availaible Contains two dies: the GPU and the Starbuck/Espresso. WUP-50 contains the revised B1X SoC.
U2-5 Micron "2LE12" "D9PXV" Datasheet RAM (4 BGA chips) (Some models use drop-in replacement hynix RAM)
U6 Macronix "MXIC MX" "25L6406E" "M21-12GF" "3K645400" "L122483" Datasheet
U7 DRH-WUP 811309G31 Overview Connects the Gamepad to the SoC via 5GHz Wi-Fi and USB
U8 SMC "1537EE402" "301" SMC. "1537EE402" is different depending on board revision.
U14 Panasonic "MN864718" HDMI Controller
U17/U19 "L1305" "23L0002" "3N188" "200" / "S6450" "A024" "DE83" "0023" RTC. U17 (top RTC) has labels similar to those found on the MX chip on the Wii. U19 (bottom RTC) has labels similar to U1041. Only one is populated.
U18 SAMSUNG "222" "K9K8G08U1D" "SCB0" Datasheet Wii U OS/vWii NAND Flash (dual 4Gb banks). Toshiba, Hynix, and Spansion NANDs were also used.
U20 SAMSUNG "228" "KLMBG4GE4A-A001" "WCF652C1" General info 32GB eMMC (in 8 32Gb banks). Toshiba and Hynix eMMCs were also used.
Q1019,1024,1037 Fairchild DC4AY PFETs for 1v/1.15v switching regulators.
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