31
edits
Changes
Completely revamp the page. WUP-30 scans will be added soontm
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−=== Wii U Mainboard PCB, Top view (SIDE-B) ===+[[Image:Mainboard_Front.jpg|800px]]
−Another photo, without markings:+[[File:WUP-001 Motherboard.jpg|200px]]+
+! Colour
|
|Yellow
|Orange
−|SAMSUNG "228" "KLMBG4GE4A-A001" "WCF652C1"
−|[https://web.archive.org/web/20141014035726/http://www.samsung.com/global/business/semiconductor/file/media/Samsung_eMMC_Brochure-0.pdf General info]
−|32GB [[Hardware/EMMC NAND|eMMC]] (in 8 32Gb banks)
−|-
−|
−|
|SAMSUNG "222" "K9K8G08U1D" "SCB0"
−|[[Media:K9k8g08u1d.pdf|Datasheet]]
−|Wii U OS/vWii [[Hardware/TSOP_NAND|NAND Flash]] (dual 4Gb banks)
|Red
|Blue
|-
−|U7
−|Green
−|DRH-WUP 811309G31
−|[http://libdrc.org/docs/re/overview.html Overview]
−|Connects the Gamepad to the SoC via 5GHz Wi-Fi and USB
The Wii U had 3 motherboard revisions after the launch WUP-01 board.
−== WUP-01 ==
+=== Top view (SIDE-B) ===
+[[File:WUP-01_top.jpg|500px]]
+=== Bottom view (SIDE-A) ===
+[[File:WUP-01_bottom.jpg|500px]]
−== WUP-30 ==
+=== Top view (SIDE-B) ===
+TODO
+=== Bottom view (SIDE-A) ===
+TODO
−=== Wii U Mainboard PCB, Bottom view (SIDE-A) ===
+== WUP-40 ==
−[[File:WiiU_motherboard_sideA.jpg|200px]]
+=== Top view (SIDE-B) ===
+[[File:WUP-40_top.jpg|500px]]
+=== Bottom view (SIDE-A) ===
+[[File:WUP-40_bottom.jpg|500px]]
−=== Chip listing: ===
+== WUP-50 ==
+=== Top view (SIDE-B) ===
+[[File:WUP-50_top.jpg|500px]]
+=== Bottom view (SIDE-A) ===
+[[File:WUP-50_bottom.jpg|500px]]
+== Chip listing: ==
{| class="wikitable sortable"
{| class="wikitable sortable"
! Label
! Label
−! Chip Name
! Chip Name
! Datasheet
! Datasheet
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|-
|-
|U1
|U1
−|"(c)'12 NINTENDO" "AMD" "IBM" "RENESAS JAPAN" "C120234F5-852-UAA A" "1229LP7B7"
|"(c)'12 NINTENDO" "AMD" "IBM" "RENESAS JAPAN" "C120234F5-852-UAA A" "1229LP7B7"
|None availaible
|None availaible
−|Contains two dies: the GPU and the [[Hardware/Starbuck|Starbuck]]/[[Hardware/Espresso|Espresso]]
+|Contains two dies: the GPU and the [[Hardware/Starbuck|Starbuck]]/[[Hardware/Espresso|Espresso]]. WUP-50 contains the revised B1X SoC.
|-
|-
|U2-5
|U2-5
−|Micron "2LE12" "D9PXV"
|Micron "2LE12" "D9PXV"
|[[Media:4Gb_1_35V_DDR3L.pdf|Datasheet]]
|[[Media:4Gb_1_35V_DDR3L.pdf|Datasheet]]
|RAM (4 BGA chips) (Some models use drop-in replacement hynix RAM)
|RAM (4 BGA chips) (Some models use drop-in replacement hynix RAM)
|-
|-
−|U20
+|U6
−|Macronix "MXIC MX" "25L6406E" "M21-12GF" "3K645400" "L122483"
|Macronix "MXIC MX" "25L6406E" "M21-12GF" "3K645400" "L122483"
|[[Media:MX25L6406E_DS_EN.pdf|Datasheet]]
|[[Media:MX25L6406E_DS_EN.pdf|Datasheet]]
|
|
|-
|-
+|U7
+|DRH-WUP 811309G31
+|[http://libdrc.org/docs/re/overview.html Overview]
+|Connects the Gamepad to the SoC via 5GHz Wi-Fi and USB
+|-
+|U8
+|SMC "1537EE402" "301"
|
|
−|Black
+|SMC. "1537EE402" is different depending on board revision.
−|-
|-
|U14
|U14
−|Panasonic "MN864718"
|Panasonic "MN864718"
|
|
|HDMI Controller
|HDMI Controller
+|-
+|U17/U19
+|"L1305" "23L0002" "3N188" "200" / "S6450" "A024" "DE83" "0023"
+|
+|RTC. U17 (top RTC) has labels similar to those found on the MX chip on the Wii. U19 (bottom RTC) has labels similar to U1041. Only one is populated.
+|-
+|U18
+|SAMSUNG "222" "K9K8G08U1D" "SCB0"
+|[[Media:K9k8g08u1d.pdf|Datasheet]]
+|Wii U OS/vWii [[Hardware/TSOP_NAND|NAND Flash]] (dual 4Gb banks). Toshiba, Hynix, and Spansion NANDs were also used.
+|-
+|U20
+|SAMSUNG "228" "KLMBG4GE4A-A001" "WCF652C1"
+|[https://web.archive.org/web/20141014035726/http://www.samsung.com/global/business/semiconductor/file/media/Samsung_eMMC_Brochure-0.pdf General info]
+|32GB [[Hardware/EMMC NAND|eMMC]] (in 8 32Gb banks). Toshiba and Hynix eMMCs were also used.
|-
|-
|Q1019,1024,1037
|Q1019,1024,1037
−|Fairchild DC4AY
|Fairchild DC4AY
|
|
−|Inductors nearby, so probably some sort of PMIC/Switching Regulator
+|PFETs for 1v/1.15v switching regulators.
−|}
|}