Motherboard
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The Wii U had 3 motherboard revisions after the launch WUP-01 board.
WUP-01
Top view (SIDE-B)
Bottom view (SIDE-A)
WUP-30
Top view (SIDE-B)
TODO
Bottom view (SIDE-A)
TODO
WUP-40
Top view (SIDE-B)
Bottom view (SIDE-A)
WUP-50
Top view (SIDE-B)
Bottom view (SIDE-A)
Chip listing:
| Label | Chip Name | Datasheet | Notes |
|---|---|---|---|
| U1 | "(c)'12 NINTENDO" "AMD" "IBM" "RENESAS JAPAN" "C120234F5-852-UAA A" "1229LP7B7" | None availaible | Contains two dies: the GPU and the Starbuck/Espresso. WUP-50 contains the revised B1X SoC. |
| U2-5 | Micron "2LE12" "D9PXV" | Datasheet | RAM (4 BGA chips) (Some models use drop-in replacement hynix RAM) |
| U6 | Macronix "MXIC MX" "25L6406E" "M21-12GF" "3K645400" "L122483" | Datasheet | |
| U7 | DRH-WUP 811309G31 | Overview | Connects the Gamepad to the SoC via 5GHz Wi-Fi and USB |
| U8 | SMC "1537EE402" "301" | SMC. "1537EE402" is different depending on board revision. | |
| U14 | Panasonic "MN864718" | HDMI Controller | |
| U17/U19 | "L1305" "23L0002" "3N188" "200" / "S6450" "A024" "DE83" "0023" | RTC. U17 (top RTC) has labels similar to those found on the MX chip on the Wii. U19 (bottom RTC) has labels similar to U1041. Only one is populated. | |
| U18 | SAMSUNG "222" "K9K8G08U1D" "SCB0" | Datasheet | Wii U OS/vWii NAND Flash (dual 4Gb banks). Toshiba, Hynix, and Spansion NANDs were also used. |
| U20 | SAMSUNG "228" "KLMBG4GE4A-A001" "WCF652C1" | General info | 32GB eMMC (in 8 32Gb banks). Toshiba and Hynix eMMCs were also used. |
| Q1019,1024,1037 | Fairchild DC4AY | PFETs for 1v/1.15v switching regulators. |